Diamond Wire Saw for Cutting Gemstone Saphire Jade Silicon Slice Semiconductor

Electroplated diamond cutting wire is a type of abrasive diamond wire. Based on the abrasion and cutting principle between the diamond grit electroplated on the steel wire and the workpiece materials, the abrasive particles do not directly act on the wire saw. Such rigid cutting method greatly improved the cutting efficiency.

 

Thin diamond wire advantages:

1) Durable, strong tensile strength. Capable of cutting large-sized ingots; Material-saving, high-efficiency and cost-effective

2) Capable of cutting materials with high rigidity and high brittleness such as sapphire

3) Little damage on the processed surface, little deformation

4)Small diameter, small cutting seam, thin slices, with uniform thickness

Diameter: 0.3mm, 0.4mm, 0.5mm, 0.8mm, 1mm.

 

ChinShine electroplated diamond wire,  used for cutting of hard material such as gem stone, saphire, jade, silicon slice, glass, Semiconductor and other precious hard materials.